Wafer Cases Shin-Etsu Polymer has two kinds of front opening shipping boxes (FOSB) used for transporting wafers between wafer and device manufacturers. We also make front opening unified pods (FOUP) for device makers' manufacturing processes. Shin-Etsu Polymer's FOSB and FOUP are known for their high quality and reliability in the global semiconductor industry. more details
		Embossed Carrier Tape & Top Cover Tape Shin-Etsu Polymer's carrier tape is used for automated mounting of electronic components. We manufacture tapes that are always precise in terms of form, dimension, and pitch. We also employ three embossing methods: press, vacuum and air compressed forming. These embossing methods allow us to manufacture components of various sizes and shapes for our customers.
		Chip Fixture Plates With experience and expertise in micro-perforation and flatness precision technology, Shin-Etsu Polymer develops carrier plates (called "KSPs") for the electrode process in ceramic capacitors. Shin-Etsu Polymer also manufactures the Shin-Etsu HSP, which enables users to select a level of adhesiveness for holding and transporting electronic components and semiconductor devices.