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Product Info > High Technology Products Business Unit >
Electronics Material Handling Products Division
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Wafer Cases
Shin-Etsu Polymer manufactures wafer shipping boxes used to transport silicon wafers between wafer manufacturers and electronic device makers, as well as FOUPs used to transfer wafers in the process of production at electronic device makers. Our greatest strength in wafer shipping boxes lies in our excellent production environment and analytical technologies, which provide the levels of high purity and dimensional precision demanded by the semiconductor fabrication industry. In addition to meticulous materials control, we conduct all manufacturing processes, from molding and assembly to packaging and shipping, in dedicated clean-room facilities in order to enable nano-level inspection and testing of impurities.
To date, our production has centered on 200mm wafer containers, for which we have a 45% share of the global market. At present, however, we are bolstering production of 300mm products, where demand is growing sharply. We have a more than 50% global share for Front Opening Shipping Boxes (FOSBs), used for transporting 300mm wafers between plants, and a more than 40% global share for FOUPs. As a member of Semiconductor Equipment and Materials International (SEMI), an international organization representing the semiconductor industry, we are working to promote international standardization of interchangeable wafer containers.
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Carrier Tapes
Carrier tape is a packaging material used in the automated electronic component mounting process. Therefore, it is required to have a pocket-like design to hold components securely while allowing easy insertion and extraction. We have the ability to manufacture tapes that are continuously and consistently precise in terms of form, dimension, and pitch. We cover three embossing methods-air-compressed forming, vacuum forming, and press forming-enabling us to offer tapes that match various component sizes and shapes. This provides a high level of design flexibility and makes us better able to meet customersEdiversified needs.
Semiconductor devices and electronic components are becoming more and more compact, especially those used in mobile equipment. Shin-Etsu Polymer has succeeded in developing 4mm-wide carrier tape, suitable for the latest chip sizes, for use in miniature devices and wafer-level chip scale packaging (WL-CSP).* We currently lead the industry with a domestic market share of around 30% and a global share of about 20%.
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