Compression based Z-Axis interconnection features film substrate with silver conductive elastomeric columns. Column position can be arranged to suite specific application. Low inductance and high current carrying capacity ensure reliable high speed connection Ideal solution for hard to solder large device and PCB to PCB interconnection.

Outline Dimensions

Instance of Dimensions

Item	Unit
Total Height	A	mm	5
External Diameter	B	mm	23
Negative Contact Length	C	mm	4
Positive Contact Length	D	mm	3

* For standard tool set and custom shape/dimensions, please contact your sales engineer.

Basic Properties

Item	Part	Unit	Value
Contact Registance	Conductor Portion	M	<100
Specific Gravity	Whole		1.15
Elonggation	Holder portion	%	>250
Hardness	Negative Contact	ISO 7619	70
	Positive Contact		70
	Positive Contact (Insulation)		20
	Holder Portion		50
Insulation Registance	Elastomer	M	>100
Current Capacity	Conductor Portion	mA/mm	100
Operating Temp.	Whole	°C	-25~85

* All data or numeric values indicated herein were measured by Shin-Etsu with internal
   test specification.

Compression Force VS. Deflection Amount