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Overview

Electronics Device Business Unit
RC Division

Connector Division
By Type
By Application
cellular phone/mobile phone
- GB-U type
- GB-Mic type
- GB-Speaker type
 
flat panel display module
- SS Type
- SEC Type
- JC type
- JS type
 
integrated circuir mounting
- GB-E type
 
semiconductor device inspection
- MT type
- MT-P type
- MAF type
 
board to board application
- PI type
- GB-Matrix type
 
Assist Carrier
VCF Type


High Technology Products Business Unit

PVC Products Business Unit

Automotive Industry

Electronics Industry

Semiconductor Industry

Medical Industry

 
Product Info > Electronics Device Business Unit > Connector Division > By Application


Tip of wire is protruded from the base elastomer for 20um and Ni/Au plating was done to improve contact.

Initial contact start at very low compressed stage thus reduce mechanical strain on device under test.

Comparing to MT-T type, MT-P type has much improved durability (Depend on device type).

Outline Dimensions

Dimensional Tolerances

0.25T 0.15T
  Thickness mm 0.25 +0.05 -0 0.15 +0.05 -0
  Pitch mm Pi: 0.10 ± 0.03, Ps: 0.10 ± 0.05
  Length mm Max : 15 ± 0.5 Min : 5 ± 0.5
  Width mm Max : 50 ± 1.0 Min : 5 ± 0.5
  Offset mm 0.125 0.075


Characteristics

This document may not be copied wholly or in part without prior written permission from Shin-Etsu Polymer Co., Ltd. Shin-Etsu Polymer will not bear the responsibility for negative effect incurred as a result of the use of this product, regardless of the content of this document.

 
 
 

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