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Overview

Electronics Device Business Unit
RC Division

Connector Division
By Type
By Application
cellular phone/mobile phone
- GB-U type
- GB-Mic type
- GB-Speaker type
 
flat panel display module
- SS Type
- SEC Type
- JC type
- JS type
 
integrated circuir mounting
- GB-E type
 
semiconductor device inspection
- MT type
- MT-P type
- MAF type
 
board to board application
- PI type
- GB-Matrix type
 
Assist Carrier
VCF Type


High Technology Products Business Unit

PVC Products Business Unit

Automotive Industry

Electronics Industry

Semiconductor Industry

Medical Industry

 
Product Info > Electronics Device Business Unit > Connector Division > By Application


JS-type Inter-Connectors consist of conductive silver/carbon traces printed on polyester film. Adhesive material, in which conductive particle is dispersed, is applied to the traces to heat-seal the connectors to other components. The adhesive type has the altermative of KN or LA. KN-type is a semi thermosetting adhesive and LA-type is a thermosetting adhesive. Due to the heat resistance and peel-strength of LA-type, this type can be used for automotive applications. Besides, the component contains no chlorine, Both KN and LA are compatible with ZIF connector, which is easily inserted and extracted with some force.

Outline Dimensions

Dimensions and Tolerances

  Item Unit Standard
  Size L×H* mm 100×150 max.
  Dimension Tolerance Length (L)
Height (H)
mm ±0.25
H120±0.25 H>120±0.5
  Width of Conductor (Tc) mm 0.1min.
  Pitch Tolerance ±0.05 (P<1.0)±0.03 (0.2P0.4)
±0.10 (P1.0)
  Accumulative Pitch (TP) mm ±0.05 (P0.4,TP100)
±0.10 (P>0.4,TP100)
  Pitch (P) mm 0.2
  Thickness of Base Film µm 25
  Thickness of Cover Film (option) µm 12 or 25

* Max.sizes depend on pitch.
Shin-Etsu Inter-Connector has been registered in European Community, TM No.000299016, and in the United States of America, TM No.2078941.


Construction

   JS-LA Type JS-KN Type
  Base Film Polyester Polyester
  Conductive Lines Thermosetting resin silver/
carbon ink
Thermosetting resin silver/
carbon ink
  Adhesive Thermosetting synthetic rubber Thermosetting synthetic rubber
  Condutive Particles Gold plated plastic particles Gold plated plastic particles
  Insulation Layer* Printed UV setting resin Printed themoplastic synthetic rubber

* Optional: polyester cover film, polyester stiffner for ZIF connector.


Basic Properties

  Item KN Data LA Data Conditions
  Conductive Resistance 0.5/ 0.5/ 10~30°C, 30~80%RH
  Insulation Resistance 100M 100M 10~30°C, 30~80%RH
  Peel Strength (Initial) 2.94N/cm 4.90N/cm 90° peel, 100 mm/min.
  Storage Time 6 months max. 6 months max. Sealed, 0~40°C, RH50%


Bonding Conditions Range

  Type JS-LA Type JS-KN Type
  Adhesive Temperature 160°C~190°C 140°C~170°C
  Pressure 4.0±0.5MPa 3.5±0.5MPa
  Time 6±2 seconds
(Adhesive temp160°C)
7±2 seconds
(Adhesive temp140°C)

* This temperature should be applied only to the bonding area. Surfaces should be free of dust and contamination.


Note:

  • Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
  • The quality of the connector, which has been already assembled, is out of guarantee.
  • Please make sure to see about the purpose/conditions of use and practice your own test.
  • Industrial ownership like patent doesn't guarantee the usage of the connector.

     
     
     

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